Wafer-Scale Assembly of Semiconductor Nanowire Arrays by Contact Printing

摘要

Controlled and uniform assembly of "bottom-up" nanowire (NW) materials withhigh scalability has been one of the significant bottleneck challenges facingthe potential integration of nanowires for both nano and macro electroniccircuit applications. Many efforts have focused on tackling this challenge, andwhile significant progress has been made, still most presented approaches lackeither the desired controllability in the positioning of nanowires or theneeded uniformity over large scales. Here, we demonstrate wafer-scale assemblyof highly ordered, dense, and regular arrays of NWs with high uniformity andreproducibility through a simple contact printing process. We demonstratecontact printing as a versatile strategy for direct transfer and controlledpositioning of various NW materials into complex structural configurations onsubstrates. The assembled NW pitch is shown to be readily modulated through thesurface chemical treatment of the receiver substrate, with the highest densityapproaching ~8 NW/um, ~95% directional alignment and wafer-scale uniformity.Furthermore, we demonstrate that our printing approach enables large-scaleintegration of NW arrays for various device structures on both Si and plasticsubstrates, with a controlled semiconductor channel width, and therefore ONcurrent, ranging from a single NW (~10 nm) and up to ~250 um, consisting of aparallel array of over 1,250 NWs.